Universal-300FS is a 12-inch CMP equipment innovatively developed by Hwatsing to meet the the leading-edge demands of the industry, integrating advanced cleaning processes, high efficiency and high stability. The equipment is equipped with diverse advanced cleaning technologies, superior polishing units, Integrates with multiple endpoint detection technologies, demonstrating superior comprehensive performance. It can better achieve global planarization of wafers at the nanometer level, meeting the needs of advanced logic process technologies, and is widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon chips,etc.
Single-head with single-platen polishing system
Polishing heads with eight independent air pressure zones
Integrate multiple endpoint detection technologies
Adapted for smart pad conditioning technology
Vertical cleaning technology and Marangoni drying technology,achieve ultra-clean performance
Meet the technical requirements of advanced process