Versatile-GH300 is a new generation 12-inch ultra-precision wafer grinding equipment developed according to the current high-end market demand of 3D IC manufacturing,advanced packaging and so on.The equipment achieves fully automated ultra-precision grinding, stress removal, and cleaning-drying through an innovative overall machine layout, optimized high rigidity structural design, and integration of advanced ultra-precision grinding, precision control, and post-cleaning technologies.Relying on advanced thickness uniformity and surface defect control technology, it can achieve excellent TTV performance, effectively meeting the stringent process requirements for flatness and consistency of ultra-thin wafers and advanced packaging; at the same time, through efficient grinding cycles and stable process integration, it has a high WPH production capacity, balancing processing precision and production efficiency. The equipment can be flexibly expanded according to actual needs, with the development of various configurations,It greatly satisfies the technical requirements for ultra-precision thinning for wafers in fields such as 3D IC manufacturing and advanced packaging.
Integrating advanced ultra-precision grinding and cleaning processes
Advanced thickness uniformity and suface defect control technology
High TTV, high WPH, flexible process development
Flexibly expanded and developed a variety of configurations