Master-BT300 is a 12 inch wafer edge precision polishing and trimming equipment developed based on advanced packaging requirements. It is used to solve problems such as wafer edge chipping, burrs, and to trim wafers. This equipment integrates high-precision polishing, trimming, efficient cleaning, and precise measurement functions. It adopts a modular design that can flexibly configure functions to meet the requirements of wafer edge polishing and trimming in advanced packaging fields such as HBM.
Modular design meets edge polishing requirements in different fields
Effectively fixing defects such as chipping and burrs on the wafer edge
Wafer trimming into a specific shape according to the customer's process requirements
High-efficiency cleaning technology
High-precision measurement system for online detection and evaluation of polishing results