The Master-P510 polishing equipment is a high-precision polishing device for panel-level products in fields such as advanced packaging and glass substrates, specifically designed to meet the ultra-planarization and low-defect polishing requirements of panels with dimensions not exceeding 510mm×515mm. Featuring a single polishing head and a single platen, it boasts low maintenance costs, flexible process switching, and no need for complex supporting facilities.
Panel-level CMP equipment
Multiple advanced endpoint detection technology integrated
Compatible with rectangular products up to 510mm*515mm