Universal-200 is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing units with superior performance, compatible with 4/6/8/inch wafers, suitable for a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in silicon wafers, third-generation semiconductors, MEMS and other manufacturing processes.
Multi-section polishing head
Compatible with 4/6/8-inch wafer
Small floor area and high cost performance
Satisfy mature process technology requirements